Heat Sealing Technology and Engineering for Packaging: Principles and Applications
DEStech Publications, Inc, 2009 - 251 pages
This book is the first to cover all phases of heat sealing as it relates to packaging. Beginning with the basics of heat-sealing processes and thermoplastic materials, the book explains, with numerous formulas and original experimental data, all the key parameters. With this information, the author presents new ways to improve the reliability of heat sealing—and the quality of heat-sealed packaging. Novel monitoring techniques are provided that enable packaging engineers to better control parameters that lead to safer, more effective seals in pouches, bags and cups, and with different materials, including laminates. Specifically, the author shows how important it is to have accurate measurement of the melting surface. The book explains techniques for carrying out such measurements and demonstrates how they lead to better heat seal process control. These techniques, along with novel ways of using the peel seal and tear seal, are explained in practical terms, to assist engineers to troubleshoot and eliminate problems encountered in heat sealing, e.g., overheating, polyball, and packaging failure. Hundreds of illustrations and numerous case studies support the practical information in this book. The technical data found in this resource is a necessary supplement to JIS and ASTM standards.
Avis des internautes - Rédiger un commentaire
Aucun commentaire n'a été trouvé aux emplacements habituels.
Autres éditions - Tout afficher
adhesion adjustment analysis angle method applied ASTM causes co-polymer cohesive bonding Compo Seal crinkles delamination easy peel evaluation foaming function HACCP heat capacity heat jaw heat seal strength heat seal technology heat sealant heat sealant polymers Heat sealed packages heat sealing process heat-sealed edge heat-sealed films heat-sealed surface heated film heating block heating method heating temperature induction sealing inflection point JIS standard method JP Patent Kazuo Hishinuma laminate films matrix measured melting surface temperature MTMS non-heating stand overheating packaging failure packaging films packaging materials peel energy peel seal perature pinholes polyball polymer films polymer materials press pressure problems proper heating retort pouch sample seal and tear sealed films sealed region sealed surface Section sensor shown in Figure simulation single-side heating specimens stress tear seal Teflon sheet temperature range temperature response tensile strength tensile testing thermal conduction thermal degradation thermal denaturation thermoplastic polymers thickness tion ture welding width